JPH0231181U - - Google Patents
Info
- Publication number
- JPH0231181U JPH0231181U JP11011788U JP11011788U JPH0231181U JP H0231181 U JPH0231181 U JP H0231181U JP 11011788 U JP11011788 U JP 11011788U JP 11011788 U JP11011788 U JP 11011788U JP H0231181 U JPH0231181 U JP H0231181U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- solder resist
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011788U JPH0231181U (en]) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11011788U JPH0231181U (en]) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231181U true JPH0231181U (en]) | 1990-02-27 |
Family
ID=31346986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11011788U Pending JPH0231181U (en]) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231181U (en]) |
-
1988
- 1988-08-22 JP JP11011788U patent/JPH0231181U/ja active Pending